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Qualcomm unveils new connected car platform

American semiconductor giant Qualcomm unveiled a concept car with a new connected vehicle platform, which is said to support a digital cockpit and advanced driver assistance systems (ADAS) on a single chip.

It says Snapdragon Ride Flex system-on-chip (SoC) will be the automotive industry’s “first scalable SoC family” to offer this capability and will be in production by 2024.

The Ride Flex platform is a 4-nanometer SoC and is an expanded version of the original Snapdragon Ride released in 2020. Automakers will be able to use the platform to deliver multiple levels of functionality and performance varies through low-end cars to high-end cars.

Qualcomm says its concept car, unveiled at this week’s CES tech conference in Las Vegas, highlights the technological capabilities of the Snapdragon Digital Chassis by using not only the new SoC, but also the Snapdragon Cockpit Platform and Snapdragon Automated Connectivity Platform.

The Flex SoC will support ADAS features such as autonomous emergency braking, blind spot assist, adaptive cruise control, lane keeping and parking assist, as well as autonomous driving on highway autopilot. speed.

Qualcomm’s next-generation cockpit will be developed in collaboration with US automotive technology supplier Visteon.

The Visteon SmartCore cockpit will integrate expected cockpit features such as a network-upgradable digital instrument cluster and an Android infotainment system with cloud-assisted navigation, radio, multi-playback media and intelligent voice assistant applications.

Cameras are also used both inside and outside for surrounding vision and driver assistance, driver monitoring and remote monitoring.

Qualcomm is working on using cloud data, facial and voice recognition to power features like personalized infotainment, 3D navigation, and multiple cockpit displays.

Sachin Lawande, President and CEO of Visteon said: “Visteon’s SmartCore software platform provides a complete solution to address consumer needs for a user experience that matches their expectations. surname.

“The combination with the Snapdragon Cockpit Platform will enable automakers to deliver cutting-edge features and functionality in their next-generation cockpits quickly with targeted manufacturing programs. target by 2025.

“We are making it easier and more cost-effective for automakers and Tier 1 to embrace the transition to an integrated, open, and scalable architecture across all vehicle levels. with our integrated suite of hardware, software and ADAS/AD stack solutions,” said Nakul Duggal, general manager, automotive, Qualcomm.

Qualcomm has said that the Flex SoC is “currently sampling with all major Tier 1 vendors targeting global production vehicles by 2025”, with BMW being the one of the major registered manufacturers to use chip technology in its ‘Neue Klasse’ vehicles.

Focusing on the auto industry as a key growth area as autonomous and assisted driving continues to grow, Qualcomm says its ordering system is worth more than $30 billion (44, 3 billion Australian dollars).

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