Tech

Source: SK Hynix to select a US location for its chip packaging plant, which will qualify for funding under the CHIPS Act, by Q1 2023 and enter mass production in 2025 -2026 (Alexandra Alper / Reuters)




Alexandra Alper / Reuters:

Source: SK Hynix to select a US location for its chip packaging plant, which will qualify for funding under the CHIPS Act, by Q1 2023 and enter mass production in 2025 -2026– South Korea’s SK Hynix aims to pick a location in the United States for its cutting-edge chip packaging plant and break ground around it…





Source link

news7h

News7h: Update the world's latest breaking news online of the day, breaking news, politics, society today, international mainstream news .Updated news 24/7: Entertainment, Sports...at the World everyday world. Hot news, images, video clips that are updated quickly and reliably

Related Articles

Back to top button
Immediate Peak